The global leader in non-destructive thermal conductivity testing solutions.
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ALT Diagram showing three thermal transport systems. All have a heater shown by a rectangle that is red on the left and blue on the right. On the right is a yellow block labeled heat sink. Green arrows labeled H show the external magnetic field. On each, blue arrows labeled J show the thermal current pointing from the red side to the blue side of the rectangle. The far left system is labeled conventional and shows H pointing up. The middle is labeled planar-parallel and shows H pointing the same direction as J. The right is labeled planar perpendicular and has H pointing along the edge of the rectangle down and to the right.
ALT Heat dissipation properties and processability of the composite gels. (a) Thermal conductivity of the composite gels. (b) Thermal management application of the composite gels in heat dissipation of CPU microprocessors. (c) Temperature evolution of a ceramic heater as a function of the heating time at various power densities at steady state. (d) T3Ster coupled with shaking table tests on selected samples to continuously detect the real-time surface maximum temperature of chip. (e) Thermal shock stability and thermal durability of M500 in cyclic heating/cooling tests. (f) Shear viscosity of uncured composite gels at constant shear rate of 5 s–1. (g) Shear viscosity of corresponding pure polymer matrix with shear rate from 0 to 10 s–1. (h) Photographs of the dispensing process of M500.
