Beth Keser (@dockeser) header
Beth Keser (@dockeser) profile picture
Joined May 2015
Photo by Beth Keser (@dockeser)Photo by Beth Keser (@dockeser)Photo by Beth Keser (@dockeser)Photo by Beth Keser (@dockeser)Photo by Beth Keser (@dockeser)Photo by Beth Keser (@dockeser)Photo by Beth Keser (@dockeser)Photo by Beth Keser (@dockeser)Photo by Beth Keser (@dockeser)Photo by Beth Keser (@dockeser)
I excited to work with @SEMIconex team and Technical Community on our latest semiconductor challenges and solutions!
We are pleased to welcome Beth Keser as VP, Technology Coalitions. Beth is a recognized global semiconductor leader with more than 30 years of experience in advanced packaging, chiplets, and heterogeneous integration. An IEEE Fellow and accomplished industry executive, Beth has held senior technology leadership roles at Motorola, Qualcomm, and Intel, holds more than 50 U.S. patents and patents pending, and has been widely recognized for her contributions to advancing semiconductor packaging technologies. In this role, Beth will continue to strengthen SEMI’s ability to bring members and industry stakeholders together around the technology challenges and opportunities shaping the future of the semiconductor ecosystem. She will lead SEMI’s Technology Coalitions, Smart Initiatives, Standards, strategic collaborations and public-private R&D partnerships, building on the work already underway to accelerate collective solutions, expand industry participation, and advance SEMI’s thought leadership as the industry evolves. Beth has already jumped into her role meeting with members at recent SEMI events. Beth remarked: “I’m excited to join SEMI at such an important time for our industry. After decades focused on advancing semiconductor technology from the back end, I’m looking forward to bringing that perspective to a broader ecosystem—connecting technology, industry leaders, and end markets to help address the challenges and opportunities ahead.” Please join us in welcoming Beth to SEMI.
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Element 6 (think diamond) and Entegris Announce Strategic Collab (think GPU cooling) e6.com/en/about/news/element…
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NVIDIA subsidizing assembly and substrate buildouts. marklapedus.substack.com/p/n…
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“The old rule that scale-up is copper and scale-out is optical is starting to blur. As data rates climb inside the rack, copper is running into physical limits around loss, reach, and power, challenging the ability of copper within a rack." semiengineering.com/coppers-…
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