#AppliedMaterials is doubling down on #hybridbonding, planning to raise its stake in #BESI from 9% to 20%. The Dutch firm reportedly holds around 70% of the global hybrid bonding equipment market.💡More: pse.is/9t3ya2 🔗

🚀 #MicroLED optical interconnects are gaining traction in AI infrastructure! U.S. smart glasses maker Vuzix showcased its Causeway waveguide platform at OCP, supporting Micro LED and VCSEL light sources for high-density optical connections.💡More: pse.is/9t3ded 🔗

Another price hike in the works? #TSMC is reportedly eyeing a 20% jump in #CoWoS prices, on top of planned foundry price increases, as AI GPUs, server CPUs, and custom ASICs fuel a fresh surge in advanced packaging demand.💡More: pse.is/9t2595 🔗

A new breakthrough in fourth-generation semiconductors? China’s Jiachi Power Technology claims a world-first vertical gallium oxide MOSFET, delivering over 1 A of on-state current and 900 V breakdown voltage—setting multiple performance records.💡More: pse.is/9szvlw 🔗

A 2,330% profit surge! Chinese #SiC firm SICC, a rival to global players like Wolfspeed, saw net profit jump to CNY 27.22M in 9M26, fueled by demand for automotive-grade conductive substrates as EV makers accelerate the shift to 800V platforms.💡More: pse.is/9sxxka 🔗

#Micron says #AI cut data center #SSD controller design time by 50% and product development time by 60% vs. the prior generation, and plans $10B over the next decade for Micron Research Labs, its first dedicated U.S. memory research hub. 💡More: pse.is/9s8w97 🔗 $MU

#Micron and #Samsung both stack #HBM directly on processors: Micron's #vHBM keeps a base die and targets 2028, while Samsung's zHBM drops the 2.5D interposer, with commercialization eyed for about 2029 and as early as 2028. 💡More: pse.is/9s8w97 🔗 $MU $SSNLF

#Intel CTO Pushkar Ranade said on the Dwarkesh Podcast that Intel has already caught up with #TSMC if the measure is #technology alone, while scale will take longer; global tools allow roughly 2x more leading-edge output, not 10x.💡More: trendforce.com/news/ 🔗 $INTC $TSM

#Micron has studied 4F² #DRAM for 20+ years and still skips it, saying the density edge is near-mythical and capacitor pitch sets bit density. #CXMT (Oct. 10) and #Samsung (CTO, Oct. 14) are pursuing it, while Micron ramps 1δ in 2H27. 💡More: pse.is/9s8w97 🔗 $MU $SSNLF

#Micron targets 2028 for #vHBM, which stacks #HBM directly on processors, with vHBM 1/2/3 slated for 2028/29/30 alongside HBM5/5E/6. HBM4 delivers 2.8 TB/s per stack, and vEIM 1 aims for 2 TB/s at under 1 pJ/bit. 💡More: pse.is/9s8w97 🔗 $MU

#Amazon says #AWS large-scale compute capacity is fully booked for 2026, most of 2027 is sold out and a considerable share of 2028 is committed; CEO Andy Jassy does not expect #Memory and power shortages to end in 2027.💡More: trendforce.com/news/ 🔗 $AMZN

#Infineon and #NVIDIA are expanding their collaboration on #GaN-based power solutions for 800V DC AI data centers, paving the way for 1 MW+ racks as NVIDIA targets adoption from 2027!💡More: pse.is/9say2t 🔗

South Korea’s LX Semicon is putting 60+ patents tied to #SiC power semiconductors and epitaxial wafers on the market, signaling a retreat from the sector. With EV demand stuck in the slow lane, pressure is mounting across the SiC sector.💡More: pse.is/9saxzg 🔗

Rising memory prices and tight foundry capacity boosted #PSMC’s Q3 revenue by 80% YoY and net profit by 338%, with further 10–20% mature-node price hikes planned for 2027.💡More: pse.is/9s9qn5 🔗

#Tesla is reportedly putting KRW 1.1T on the table for AI chip substrates! The deal would lock in Samsung Electro-Mechanics’ FC-BGA supply through 2033, and #NVIDIA is said to be grabbing capacity too. 💡More: pse.is/9s9msh 🔗

#NVIDIA's #GTCBerlin keynote spotlights the supply chain: 17 DSX POD partners incl. Delta, Gigabyte, Pegatron, Wistron, plus 6 capacity suppliers (Unimicron, IBIDEN, SEM, Amkor, KYEC, SPIL). 💡More: trendforce.com/news/ 🔗 $NVDA $TSM $AMKR

#NVIDIA-linked #Groq is reportedly exploring 3D-stacked DRAM for its next-gen AI chips, potentially moving beyond #SRAM as AI models grow larger. Could this reshape AI inference chip design? 💡More: pse.is/9s79pb 🔗

[Breaking] Google Reportedly Sticks With Intel EMIB-T Despite 35% Substrate Yields as HumuFish Schedule Tightens Uncertainty is growing over potential delays to Google’s TPU v9. Industry sources point to the HumuFish variation as a key area of concern: reported yield problems with Intel’s EMIB-T substrates have raised the possibility of a switch to TSMC’s CoWoS-L. Supply chain checks, however, indicate that HumuFish remains “100%” committed to EMIB-T. Yield Gap Raises Production Readiness Concerns According to Common Wealth Magazine, EMIB-T’s architecture poses two major challenges for substrate suppliers. First, differences in thermal expansion between ABF substrates and embedded silicon bridges make precise alignment difficult during high-temperature processing. Second, NCF (Non-Conductive Film), applied beneath the bridges’ TSVs, can trap air bubbles during bonding, potentially weakening adhesion and further weighing on yields. Against this backdrop, industry sources say that EMIB-T substrate yields were around 35% in 3Q26, well short of the 50% target set for year-end. However, efforts are underway. While the reported bottleneck centers on substrate suppliers’ difficulties embedding TSV-equipped silicon bridge dies, industry sources note that Intel has adjusted its substrate electroplating process, while suppliers including Ibiden, Unimicron, and Shinko continue working to improve yields. With HumuFish not slated for mass production until 1H28, the supply chain still has time to tackle the remaining challenges, according to industry sources. TPU v9 Packaging Orders Split Between TSMC and Intel According to industry sources, Google’s TPU v9 lineup is confirmed to include three variants: Broadcom-designed WhaleFish, and MediaTek-designed HumuFish and TriggerFish. WhaleFish is expected to adopt TSMC’s CoWoS-L, with mass production slated for 2H27. HumuFish, meanwhile, is set to enter mass production in 1H28, relying exclusively on Intel’s EMIB-T. TriggerFish is also planned to use EMIB-T, with production targeted for 2H28 or later. TechNews, citing analyst Ming-Chi Kuo, further explains that TriggerFish is positioned as an upgraded TPU v9 with stronger inference capabilities, designed to address both CPU and memory bottlenecks. According to Kuo, TriggerFish features three key upgrades over HumuFish: 2–3 times the SRAM capacity, an additional simulation die, and a shift to HBM4E from HumuFish’s HBM4. HumuFish’s Potential Timeline Slip Amid recent market rumors of HumuFish’s delay, industry sources indicate that the tape-out of Google-designed Compute Die A, built on TSMC’s N2 process, has been pushed back to late October, while other dies remain on schedule. Against this backdrop, industry sources suggest the delay is expected to push back trial production of the complete package. Commercial Times further notes that the Google TPU v9 project (HumuFish) involving MediaTek could see its tape-out pushed back to January 2027 due to design revisions, potentially delaying shipments until 1Q28. Taken together, HumuFish’s 1H28 mass production target still gives the supply chain time to work through EMIB-T’s remaining issues, but a tape-out that slips to January 2027 could compress that cushion. How quickly substrate yields climb, and whether design milestones hold, will determine if HumuFish stays on schedule. The outcome will also be a key test of Intel’s ability to win large external customers for advanced packaging. More details: pse.is/9s7ywk 🔗

#NVIDIA’s new #CPO prototype moves optical engines from the package substrate onto the interposer, potentially boosting bandwidth density. Could this early-stage design shape Team Green’s future AI interconnects? 💡More: pse.is/9s776a 🔗

#Micron Taiwan's Taoyuan union announced a 24-hour strike from 9 a.m. on Oct. 22 after talks with the #Memory maker ended without agreement; the company said it signed a deal with its Taichung union the same day.💡More: trendforce.com/news/ 🔗 $MU