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T-Head, filiale puces d'Alibaba, viserait une IPO à Hong Kong en 2027 d'au moins 2 à 3 Md$, selon des médias. Si cela se confirme, la Bourse locale accueillera un acteur dépassant 470 000 puces et 10 Md RMB de revenus annualisés. Alibaba n'a pas encore réagi, premier signal à guetter.

China’s listed AI-chip makers kept revenue momentum in Q3 2026, but profits remained a weaker part of the picture. EASTMONEY says Moore Threads, MetaX and Enflame continued their first-half revenue trend. Their overall profit performance was mixed; Hong Kong-listed Iluvatar CoreX and Biren did not disclose Q3 reports. The next test is whether future reports show stronger profitability alongside revenue growth.

Samsung Electronics targets ~6-micrometer stacking with 3D Cube-H hybrid bonding, down from ~25 in TC bonding. ZDNet Korea says denser, cooler copper links for AI and HBM could boost its AI foundry bid if completed on time. Watch early 2027 for its first design kit and customer evaluations.

国产AI芯片营收看似猛增，背后不过是赔本赚吆喝。 高喊蚕食英伟达的表象下，国产算力已经撞上了流血换份额的残酷分水岭。 摩尔线程、沐曦股份纵然勉强扭亏，财报里同步显现的毛利率下滑与利润平平，死死钉住了残酷现实：抢下订单靠的不是壁垒，而是咬牙让利。 当降价成为抢跑的唯一抓手，这把蚕食对手的算盘，迟早先划破自己的利润表。

Samsung prevé terminar 3D Cube-H a inicios de 2027 y bajar de unos 25 a 6 µm con Hybrid Bonding, según ZDNet. Si logra menor consumo y más densidad para GPUs y HBM, reforzaría su puja por pedidos de fundición IA. La señal será lanzar el primer kit de diseño y abrir la evaluación con clientes.

Google rompe su ciclo bienal y lanza dos nuevos TPU para competir con Nvidia. Según Amin Vahdat, el plan apunta a chips especializados y cómputo confidencial para agentes de IA, si los clientes validan cuatro versiones. La señal a seguir llega el lunes con las variantes 8tx y 8i Max.

AI 투자 둔화 우려가 번지자 란치과기(Montage Technology)가 던진 반박은 명확합니다. 연산 칩 증설이 주춤해도 고속 상호연결과 메모리 인터커넥트 수요는 아키텍처 진화로 계속 커진다는 계산입니다. 서버 대수 자체보다 메모리 모듈 탑재량과 맞물리는 구조라 PCIe Retimer와 CXL MXC 같은 부품이 방어벽을 칩니다. 기술 규격이 올라갈수록 전송 병목을 뚫는 칩의 납품 비중이 유지되기 때문입니다. 차세대 서버 플랫폼의 CXL 상용화 속도와 메모리 모듈 채용 밀도가 이 방어 논리를 입증할 지표입니다.

Jieli Technology has pushed its JL280N, JL380N, and JL681N edge AI chips into batch design-ins. By packing proprietary NPUs into audio silicon linking to cloud LLMs, low-cost hardware gets on-device AI. The key indicator to track is mass production shipment volume from device makers.

Hot Oct US CPI led Goldman Sachs to add a third 25 bps Fed hike for March 2027 to its December call, WSN reports. January is also in play, though Goldman sees milder Nov-Dec inflation making March slightly more likely. Watch if persistent costs spark big early-year price hikes in Jan.

CGN lance le chantier principal de l'unité 4 de San'ao au Zhejiang avec le premier béton de l'îlot nucléaire. Le projet franchit un cap : sa phase 2 entre en pleine construction, validant le rythme industriel de la filière. Prochain indicateur : le respect des étapes de montage des équipements majeurs.